Warpage, Thickness and Photoresist Measurement Tools for Panel Plate and Metal Carrier




Designed to measure warpage and thickness of metal- carrier (620x620mm) and panel (600x600mm).
Warpage – To measure whether the panel surface is convex or concave by using Laser Technology and can result the review of 2D, 3D Shape.

  • Reference Distance: 200mm
  • Measurement Range ±48 mm(F.S.=96 mm)
  • Repeatability: 1µm
  • Precision: 0.096mm
  • Accuracy: 0.096mm
  • Linearity: ±0.1% of F.S.(0.096mm)
  • Measurable Material: Glass, metal Carrier, molded panel with EMC and aluminum

Thickness – To measure the thickness of panel by using dual head sensor.

  • Measurement Range: Between 70mm from bottom sensor head and 30mm from top sensor head, ±3.5 (mm)
  • Repeatability: 5µm
  • Precision: ± 4.4 µm
  • Accuracy: ± 4.4 µm
  • Linearity: ±2.2 μm
  • Measurable: Minimum 100 points

Photoresist – To measure the materials thickness of thin films by using Photoresist Technology.

  • Thickness Measurement Range: 15nm-70µm
  • Wavelength Range: 380 to 1050 nm
  • Minimum Thickness to Measure: 50 nm
  • Accuracy: The Greater of 2nm or 0.2%
  • Precision: 0.02 nm
  • Repeatability: 0.1nm
  • Stability: 0.05 µm


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